TDK 5V/50A Manuel d'utilisateur télécharger pdf (Page 10)

Data Sheet: Powereta

TM

iQP Series –Single Output Quarter Brick

©2005-2006 TDK Innoveta Inc.

iQP 5V/50A Datasheet 8/3/2006

℡

(

877

)

498-0099

10/15

performance page for the power module of

interest. In all conditions, the power module

should be operated below the maximum

operating temperature shown on

the derating curve. For improved design

margins and enhanced system reliability, the

power module may be operated at

temperatures below the maximum rated

operating temperature.

Heat transfer by convection can be

enhanced by increasing the airflow rate that

the power module experiences. The

maximum output current of the power

module is a function of ambient temperature

(T

AMB

) and airflow rate as shown in the

thermal performance figures on the thermal

performance page for the power module of

interest. The curves in the figures are

shown for natural convection through 3 m/s

(600 ft/min). The data for the natural

convection condition has been collected at

0.3 m/s (60 ft/min) of airflow, which is the

typical airflow generated by other heat

dissipating components in many of the

systems that these types of modules are

used in. In the final system configurations,

the airflow rate for the natural convection

condition can vary due to temperature

gradients from other heat dissipating

components.

Heatsink Usage: For applications with

demanding environmental requirements,

such as higher ambient temperatures or

higher power dissipation, the thermal

performance of the power module can be

improved by attaching a heatsink or cold

plate. The iQP platform is designed with a

base plate with two M3 X 0.5 through-

threaded mounting fillings for attaching a

heatsink or cold plate. The addition of a

heatsink can reduce the airflow requirement;

ensure consistent operation and extended

reliability of the system. With improved

thermal performance, more power can be

delivered at a given environmental condition.

Standard heatsink kits are available from

TDK Innoveta Inc. for vertical module

mounting in two different orientations

(longitudinal – perpendicular to the direction

of the pins and transverse – parallel to the

direction of the pins). The heatsink kit

contains four M3 x 0.5 steel mounting

screws and a precut thermal interface pad

for improved thermal resistance between the

power module and the heatsink. The

screws should be installed using a torque-

limiting driver set between 0.35-0.55 Nm (3-

5 in-lbs).

The system designer must use an accurate

estimate or actual measure of the internal

airflow rate and temperature when doing the

heatsink thermal analysis. For each

application, a review of the heatsink fin

orientation should be completed to verify

proper fin alignment with airflow direction to

maximize the heatsink effectiveness. For

TDK Innoveta standard heatsinks, contact

TDK Innoveta Inc. for latest performance

data.

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